Computer-on-Module | Single board computers 700 mhz | high performance single board computer: Computer-on-Module, or "COM," methodology has become a well-accepted way to implement many of the most demanding embedded solutions. COM can be simply defined as a module that contains all the components needed for a bootable host computer, packaged as an off-the-shelf component. System expansion and customization for each solution is implemented on an application-specific carrier board. Together, the COM and carrier board deliver the functionality of a single-board

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by Rohit Chhabra, COM Express Initiative manager, marketing manager, Infrastructure Processor Division, Intel Corp.

Overview: Computer-on-Module methodology
Many of today's most innovative embedded application segments benefit from high levels of processing performance and I/O bandwidth in extremely compact form factors. Legacy interfaces including Peripheral Component Interconnect Extended (PCI-X) and Accelerated Graphics Port (AGP) can no longer satisfy the requirements of leading-edge applications in medical imaging, retail point-of-sale and advertising terminals, gaming, and industrial automation.

Meeting the requirements of these embedded market segments will require platform developers to gradually replace legacy parallel interfaces entirely with low-voltage differential signaling (LVDS) interfaces, while taking advantage of the performance gains enabled by new generations of processors and chipsets.

The continuing evolution of processors and the emergence of the current generation of high-speed serial differential interfaces confront embedded developers with the problem of how to implement these new capabilities while maintaining focus on their core business. Clearly, the task of engineering a new single-board computer (SBC) for each new generation of processors, or to implement faster buses, is an extremely expensive and time-consuming proposition. It can also place an added burden on already thinly stretched engineering resources.

Computer-on-Module, or "COM," methodology has become a well-accepted way to implement many of the most demanding embedded solutions. COM can be simply defined as a module that contains all the components needed for a bootable host computer, packaged as an off-the-shelf component. System expansion and customization for each solution is implemented on an application-specific carrier board. Together, the COM and carrier board deliver the functionality of a single-board computer.

As the COM approach has gained in popularity, the embedded industry has recognized the need for an open COM standard to provide the advantages of modular, off-the-shelf building blocks. In addition, the industry saw the need for a standard that would enable a smooth transition from legacy interfaces, such as PCI and AGP, to legacy-free LVDS interfaces, including PCI Express, Serial ATA and Serial Digital Video Out (SDVO).

The answer is the COM Express specification from the PCI Industrial Computer Manufacturers Group (PICMG). With COM Express products beginning to appear in 2005, embedded developers interested in fast time to revenue should learn more about this robust, embedded industry standard.

COM advantages
Small and rugged, Computer-on-Module implementations are ideal for a broad range of embedded applications where they fit mechanically, economically, and functionally, and where other form factors such as add-in cards cannot be used. For embedded developers the advantages of the COM methodology include faster time to market, better control over form-fit-function, reduced development cost and risk, and lower total cost of ownership through scalability.