In this paper, we first discuss the fundamentals of optical components for communication such as optical fibers, laser transmitters, and receivers. Second, we review the optical packaging trends for optical modules and optical transceivers. Then, after a review of the various optical interconnect topologies in the enterprise, we discuss their applications and cost trends. We then move on to discuss the next-generation optical interconnects dividing them into four main categories: box-to-box, board-to-board, chip-to-chip, and on-chip interconnects. Finally, the evolution of optical interconnects and technical challenges in enterprise networks are discussed.
Read the rest of this article: click download, below.
© 2005 Intel Corp.
![]()
If you're interested in this topic, these articles may be helpful:
![]() | Cisco SMB Class Network Foundation Solutions Q&A from Cisco Systems Inc. Q. What is the Cisco small and medium b... |
![]() | Wireless enterprise networking with mobile software by Jim Geier, principal, Wireless-Nets Ltd. Intel Corp. Take a clos... |
![]() | Bluetooth boogies, part 1: file transfer with JSR-82 & OBEX - learn to use JSR-82 & OBEX to transfer files from client to server by Bruce Hopkins, technical architect, Gestalt LLC. First published by... |
![]() | Patterns of Enterprise Application Development, Chapter 1: Layering by Martin Fowler. Addison-Wesley Professional Layering is one of th... |
![]() | Schools Deploy Converged Network Services over Cisco IP Phones By Howard Baldwin First printed in iQ Magazine Although rural Charl... |
![]()
Related Jobs:


